Copper oxide ink and manufacturing method of conductive subtrate using the same, product contains coated film and manufacturing method of product using the same, manufacturing method of product with conductive pattern, and product with conductive pattern

In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing ag...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YUMOTO, TORU, TSURUTA, MASANORI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010 ≤ (reducing agent mass/copper oxide mass) ≤ 0.10 (2) 0.0050 ≤ (dispersant mass/copper oxide mass) ≤ 0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.