TWI704048B

The present invention provides: a surface-treated copper foil which achieves a balance at a high level between reflow heat resistance and transmission characteristics, while ensuring sufficient adhesion to an insulating substrate; and the like. A surface-treated copper foil according to the present...

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Bibliographische Detailangaben
Hauptverfasser:	SATO, AKIRA, UNO, TAKEO
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides: a surface-treated copper foil which achieves a balance at a high level between reflow heat resistance and transmission characteristics, while ensuring sufficient adhesion to an insulating substrate; and the like. A surface-treated copper foil according to the present invention is obtained by providing a surface roughening layer (120) on a copper foil base (110), and is characterized in that: the surface roughening layer (120) has a recessed and projected surface that is formed of roughening particles; in a cross-section that is perpendicular to the copper foil base surface, the ratio of the creepage distance (Da) measured along the recessed and projected surface of the surface roughening layer (120) relative to the creepage distance (Db) measured along the copper foil base surface, namely Da/Db is within the range of 1.05-4.00; the average height difference H between recesses and projections in the recessed and projected surface is within the range of 0.2-1.3 μm; and a silane c