TWI702644B

Provided is a semiconductor processing sheet provided with a base film and a pressure-sensitive adhesive layer laminated on at least one side of the base film, the semiconductor processing sheet being characterized in that the base film contains a vinyl chloride-based resin and an adipate ester-base...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA, MASATOMO, ADACHI, ISSEI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is a semiconductor processing sheet provided with a base film and a pressure-sensitive adhesive layer laminated on at least one side of the base film, the semiconductor processing sheet being characterized in that the base film contains a vinyl chloride-based resin and an adipate ester-based plasticizer and a terephthalate ester-based plasticizer as plasticizers and the mass ratio of the content of the adipate ester-based plasticizer with reference to the total content of the adipate ester-based plasticizer and the terephthalate ester-based plasticizer in the base film is 50-80 mass%. Even while using a replacement for alkyl phthalate esters as plasticizer, this semiconductor processing sheet exhibits a satisfactory flexibility and can suppress the occurrence of residues when peeled from an adherend.