Bendable electronic device casing and manufacturing method thereof

A bendable electronic device casing comprises a plurality of cover units and a flexible portion. The cover units are spaced apart from each other, and each cover unit includes at least an hard case. The flexible portion is at least filled and joined between two adjacent cover units. The flexible por...

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Bibliographische Detailangaben
Hauptverfasser:	TSENG, I-LIN, HUANG, PONG, WU, KUONG, CHANG, CHIA-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS TELEPHONIC COMMUNICATION
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A bendable electronic device casing comprises a plurality of cover units and a flexible portion. The cover units are spaced apart from each other, and each cover unit includes at least an hard case. The flexible portion is at least filled and joined between two adjacent cover units. The flexible portion bonds said two cover units so that said two cover units can be bended relate to each other. and manufacturing method thereof.