Electronic packages with pre-defined via patterns and methods of making and using the same

An electronic package is provided. The electronic package includes a substrate (102) and a plurality of vias defined by a corresponding plurality of pre-defined via patterns. The electronic package further a metal built-up layer (120) disposed on portions of the substrate (102) to provide a pluralit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MCCONNELEE, PAUL ALAN, GOWDA, ARUN VIRUPAKSHA, TUOMINEN, RISTO ILKKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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