Electronic packages with pre-defined via patterns and methods of making and using the same

An electronic package is provided. The electronic package includes a substrate (102) and a plurality of vias defined by a corresponding plurality of pre-defined via patterns. The electronic package further a metal built-up layer (120) disposed on portions of the substrate (102) to provide a plurality of pre-defined via locations and the plurality of pre-defined via patterns of the plurality of vias. Also, the electronic package includes a first conductive layer (152) disposed on at least a portion of the metal built-up layer (120). Moreover, the electronic package includes a second conductive layer (160) disposed on the first conductive layer (152), where the plurality of vias is disposed at least in part in the metal built-up layer (120), the first conductive layer (152), and the second conductive layer (160).