Apparatus for mounting components on a substrate

An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BILEWICZ, NORBERT, SELHOFER, HUBERT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION REGULATING SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.