TWI699459B

TWI699459B

A surface treated copper foil has a surface treated layer formed on at least one surface, the total deposition amount of Co, Ni, and Mo is 1000 μg/dm2 or less in the surface treated layer, the surface treated layer includes a particle having three or more projections, the number of the particles per...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FUKUCHI, RYO
Format: Patent
Sprache:chi
Schlagworte:
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A surface treated copper foil has a surface treated layer formed on at least one surface, the total deposition amount of Co, Ni, and Mo is 1000 μg/dm2 or less in the surface treated layer, the surface treated layer includes a particle having three or more projections, the number of the particles per μm2 in the surface treated layer is 0.4 or more, and the surface roughness Rz on a side of the surface treated layer measured by a contact type roughness meter is 1.3 μm or less.