Resin composition and polyimide resin film using the same, display substrate and manufacturing method thereof

Provided is a production method for display substrates which includes: a step in which a resin composition including (a) a polyimide precursor, (b) an alkoxysilane compound, and (c) an organic solvent is applied to a support and heated to form a polyimide resin film; a step in which a semiconductor...

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Bibliographische Detailangaben
Hauptverfasser:	ARAKAWA, YUMIKO, OOE, MASAYUKI, UEDA, ATUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a production method for display substrates which includes: a step in which a resin composition including (a) a polyimide precursor, (b) an alkoxysilane compound, and (c) an organic solvent is applied to a support and heated to form a polyimide resin film; a step in which a semiconductor element is formed on the polyimide film; and a step in which the polyimide film having the semiconductor element formed thereon is peeled from the support.