Lead frame and method for manufacturing the same

Provided are a lead frame and a method for manufacturing the same which improve the productivity of a good quality semiconductor device and make it economically possible to manufacture a high-quality semiconductor device by inhibiting occurrence of cutting burrs resulting from dicing and abrasion of a rotating blade while preventing deformation of a connecting bar. A lead frame 10 including a plurality of unit lead frames 12 vertically, horizontally, or vertically and horizontally adjacent to one another, and a method for manufacturing the lead frame, are provided. The unit lead frames 12 each include an element mounting part, leads 11 each having terminal portions 14 and 15, and a connecting bar 13. The lead 11 is disposed around the element mounting part. The leads 11 of the adjacent unit lead frames 12 are connected to each other via the connecting bar 13. In a main body 13a of the connecting bar 13, first reinforcing parts 16 which are each connected to a connection-side end portion 18 of the correspondin