TWI695652B

A laminated sealing film having a thin thickness and a high sealing performance is formed while suppressing degradation in productivity and the adhesion of foreign matters. When forming a laminated sealing film (203), which has a laminated structure where an inorganic layer (201) and an organic laye...

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Bibliographische Detailangaben
Hauptverfasser:	SENBA, SHOHEI, SATOYOSHI, TSUTOMU
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	A laminated sealing film having a thin thickness and a high sealing performance is formed while suppressing degradation in productivity and the adhesion of foreign matters. When forming a laminated sealing film (203), which has a laminated structure where an inorganic layer (201) and an organic layer (202) are stacked, on an organic EL element S having a plurality of organic EL layers (102) as a light emitting layer formed on a substrate (101), a process of forming the inorganic film (201) by an atomic layer deposition method and a process of forming the organic layer (202) by a deposition polymerization method are alternately repeated in a single process chamber (11).