TWI695492B

A semiconductor device includes a first substrate having a first face and a second face, a first semiconductor chip on the first face, a first wire which electrically connects the first semiconductor chip and the first substrate, a first resin which seals the first semiconductor chip and the first wire, a first metal bump on the second face, a second substrate below the first substrate, the second substrate having a third face and a fourth face, a second semiconductor chip on the third face and electrically connected to the first metal bump, a second wire which electrically connects the second semiconductor chip and the second substrate, a second resin between the second face and the third face, the second resin sealing the first metal bump, the second semiconductor chip and the second wire, and a second metal bump on the fourth face.