Manufacturing method of circuit board

A manufacturing method of a circuit board includes forming a through hole on a resin layer that is perforated on a substrate and an impeded layer by a laser drill and/or a mechanical drill, until a portion of the impeded layer exposed and the other portion of the impeded layer covered by the resin l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lan, Jaen-Don, Tseng, Chen-Rui, Ho, Cheng-En, Lin, Pin-Chung, Chen, Yu-An
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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