Manufacturing method of circuit board

A manufacturing method of a circuit board includes forming a through hole on a resin layer that is perforated on a substrate and an impeded layer by a laser drill and/or a mechanical drill, until a portion of the impeded layer exposed and the other portion of the impeded layer covered by the resin layer; sputtering a first conductive layer on a surface of the resin layer and a surface of the exposed impeded layer; electroless plating a second conductive layer on the first conductive layer; plating a third conductive layer with a pattern on the second conductive layer; filling the through hole for electrically connecting the first conductive layer, the second conductive layer and the third conductive layer; and etching the third conductive layer to the first conductive layer sequentially until the etched first conductive layer exposed the resin layer underneath to form an opening corresponding to the pattern.