Gas injector device used for semiconductor equipment

A gas injector device adaptable to semiconductor equipment includes a base plate, a channel cover plate and at least one middle plate disposed between the base plate and the channel cover plate. The top or bottom surface of the middle plate has a plurality of separate hollows that define a plurality...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, TSAN-HUA, WONG, KIAN-POH, JUNJI, KOMENO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A gas injector device adaptable to semiconductor equipment includes a base plate, a channel cover plate and at least one middle plate disposed between the base plate and the channel cover plate. The top or bottom surface of the middle plate has a plurality of separate hollows that define a plurality of types of separate gas outlets horizontally and vertically.