TWI688679B
Provided is a tin electroplating bath for obtaining a tin plating film for which the occurrence of tin whiskers when an external stress is applied on the tin plating film is limited. The tin electroplating bath is characterized in comprising at least one kind of compound selected from a group consis...
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| Format: | Patent |
| Sprache: | chi |
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| Zusammenfassung: | Provided is a tin electroplating bath for obtaining a tin plating film for which the occurrence of tin whiskers when an external stress is applied on the tin plating film is limited. The tin electroplating bath is characterized in comprising at least one kind of compound selected from a group consisting of flavonoid compounds and glycosides thereof, compounds having a xanthene skeleton and glycosides thereof, and compounds having an acridine skeleton and glycosides thereof. |
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