TWI687492B

Provided is a polycarbonate-imide-based resin paste which is excellent in terms of (1) solubility in nitrogen-free solvents, (2) low-temperature dryability/curability, (3) low warpage, (4) flexing characteristics, (5) printability, and (6) alkali resistance and in terms of heat resistance, chemical resistance, and electrical property. Also provided is an electronic component having a solder resist layer, surface protective layer, or adhesive layer which is obtained by curing the paste. The polycarbonate-imide-based resin paste comprises component (A), which is a polycarbonate-imide resin obtained from comonomer ingredients essentially including (a) one or more tri- and/or tetravalent polycarboxylic acid derivatives having an acid anhydride group, (b) an acid dianhydride having a polycarbonate skeleton that has a specific structure, and (c) an isocyanate compound or amine compound, component (B), which is an epoxy resin having two or more epoxy groups per molecule, and component (C), which is a filler.