TWI680952B

According to the present invention, there is provided a cutting device capable of maintaining an appropriate indentation amount of a cutting bar without being affected by the thickness of a semiconductor substrate, a protective film, and a dicing tape. The cutting device presses the cutting bar (7)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO, TAICHI, TAKEDA, MASAKAZU, KURIYAMA, NORIYUKI, MURAKAMI, KENJI
Format: Patent
Sprache:chi
Schlagworte:
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Beschreibung
Zusammenfassung:According to the present invention, there is provided a cutting device capable of maintaining an appropriate indentation amount of a cutting bar without being affected by the thickness of a semiconductor substrate, a protective film, and a dicing tape. The cutting device presses the cutting bar (7) into a semiconductor substrate (W) having a scribe line (S) on the surface to divide the substrate, one side of the semiconductor substrate (W) is covered with a protective film (3), and a dicing tape (2) is attached to the opposite side. The structure of the cutting device includes a workbench (4) for placing the semiconductor substrate (W) together with the protective film (3) and the dicing tape (2); a displacement gauge (10) for measuring the surface height of the protective film (3) or the dicing tape (2) placed on the upper surface side of the semiconductor substrate (W) of the workbench (4), and a computer (C) control part (11) that subtracts the displacement amount to the specified indentation amount of the