Integrated testing and handling mechanism and methods for supporting componenets,applying vacuum on a carrier and alingning a component

A carrier comprising: a surface configured to support a plurality of components, the surface having a plurality of holes defined therein through which a vacuum can be applied to hold the components on the surface; a first vacuum interface in communication with the plurality of holes, the first vacuum interface being connectable to a first vacuum generator such that the first vacuum generator can apply the vacuum to the components through the plurality of holes; a second vacuum interface in communication with the plurality of holes, second first vacuum interface being connectable to a second vacuum generator such that the second vacuum generator can apply the vacuum to the components through the plurality of holes. There is further provided a corresponding method and assembly.