Metallic evaporation material

Provided is a metal evaporation material with which it is possible to prevent splashing without lowering the purity of the thin film. A metal evaporation material having a metal material in which a metal is the parent member and an additive metal, wherein the additive metal has: a metal low vapor pr...

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1. Verfasser: KURAUCHI, TOSHIHARU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Provided is a metal evaporation material with which it is possible to prevent splashing without lowering the purity of the thin film. A metal evaporation material having a metal material in which a metal is the parent member and an additive metal, wherein the additive metal has: a metal low vapor pressure property such that, at a temperature of at least 700°C, the vapor pressure is less than 1/10,000th the vapor pressure of the parent material at the same temperature; and a reactivity such that the additive material reacts with gases released from a high-melting-point metal container to produce a reaction product. The reaction product has a product low vapor pressure property such that, at a temperature of at least 700°C, the vapor pressure is less than 1/10,000th the vapor pressure of the parent material at the same temperature. Bumping is prevented because the gas contained in the metal evaporation material reacts with the additive metal and is eliminated. The purity of the vapor-deposited thin film does no