TWI671268B
This method for cleaving glass films comprises: a cleaving and dividing step whereby a conveyed band-shaped glass film G is continuously cleaved by a laser cleaving method to divide the band-shaped glass film G into a non-effective portion Ga and an effective portion Gb; and a separating step of sep...
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Format: | Patent |
Sprache: | chi |
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Zusammenfassung: | This method for cleaving glass films comprises: a cleaving and dividing step whereby a conveyed band-shaped glass film G is continuously cleaved by a laser cleaving method to divide the band-shaped glass film G into a non-effective portion Ga and an effective portion Gb; and a separating step of separating, after the division, the non-effective portion Ga and the effective portion Gb in a thickness direction. During the separating step, a deformation applying step is performed in which first external forces F1 each having a thickness direction component are applied to two places on the effective portion Gb separated from each other in a width direction and in which a second external force F2 having a thickness direction component in a direction opposite those of the first external forces F1 is applied to a place between said two places in order to bend and deform the effective portion Gb along the width direction. |
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