TWI671268B

This method for cleaving glass films comprises: a cleaving and dividing step whereby a conveyed band-shaped glass film G is continuously cleaved by a laser cleaving method to divide the band-shaped glass film G into a non-effective portion Ga and an effective portion Gb; and a separating step of sep...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: IKAI, NAOHIRO
Format: Patent
Sprache:chi
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This method for cleaving glass films comprises: a cleaving and dividing step whereby a conveyed band-shaped glass film G is continuously cleaved by a laser cleaving method to divide the band-shaped glass film G into a non-effective portion Ga and an effective portion Gb; and a separating step of separating, after the division, the non-effective portion Ga and the effective portion Gb in a thickness direction. During the separating step, a deformation applying step is performed in which first external forces F1 each having a thickness direction component are applied to two places on the effective portion Gb separated from each other in a width direction and in which a second external force F2 having a thickness direction component in a direction opposite those of the first external forces F1 is applied to a place between said two places in order to bend and deform the effective portion Gb along the width direction.