Method and system for automatic bond arm alignment

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.