Substrate transmission mechanism for semiconductor processes and film deposition apparatus

A substrate transmission mechanism is used in a film deposition apparatus for semiconductor processes. The substrate transmission mechanism comprises a plurality of picking and placing portions, a plurality of front arms, and a rear arm. The picking and placing portions are respectively mounted on t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIEH, SHIH YUNG, YANG, CHIH KUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A substrate transmission mechanism is used in a film deposition apparatus for semiconductor processes. The substrate transmission mechanism comprises a plurality of picking and placing portions, a plurality of front arms, and a rear arm. The picking and placing portions are respectively mounted on the front arms, and each is used to pick and place a substrate. The front arms are mounted on the rear arm, and respectively move close or far in relative with the rear arm.