TWI666123B

The purpose of the present invention is to provide a mold release film which is suitable for the production of a flexible circuit board, and which is capable of suppressing the formation of wrinkles, while maintaining mold releasability. The present invention provides a mold release film which is suitable for the production of a flexible circuit board, and which has the front surface and the back surface that have been subjected to surface roughening. The ten-point average roughness (Rz) of the front surface is from 4 μm to 20 μm (inclusive), and a mold release layer that constitutes the back surface has a thickness of 35 μm or more (excluding the cases where the ten-point average roughness (Rz) of the front surface is from 4 μm to 5 μm (inclusive) and the mold release layer that constitutes the back surface has a thickness of from 35 μm to 36 μm (inclusive)).