SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

The present invention relates to a semiconductor package structure and a manufacturing method thereof. The semiconductor package structure includes a circuit board, a spacer mounted on the circuit board, at least one chip mounted on the spacer and an encapsulation. A bonding layer is formed on the spacer. When the encapsulation encapsulates the spacer and the at least one chip, the encapsulation is in contact with the bonding layer of the spacer. The strength of bonding between the bonding layer and the encapsulation layer is greater than the strength of bonding between a wafer and the encapsulation layer. Therefore, the strength of bonding of the encapsulation of the semiconductor package structure is increased after the encapsulation encapsulates the spacer. The warpage of the semiconductor package structure can be decreased and the delamination of the semiconductor package structure under a condition with high temperatures and high humidity can be decreased.