Position detection device, position detection method, and vapor deposition apparatus

The invention provides a position detection device, a position detection method and a vapor deposition device which can improve detection precision of positions of a substrate. An image processing unit (20) calculates relative positions of cameras (11) of a front imaging unit on the basis of results...

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Bibliographische Detailangaben
Hauptverfasser:	BANNAI, YUYA, YANAGIHORI, FUMITSUGU, YOSHIDA, YUICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL HANDLING RECORD CARRIERS IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention provides a position detection device, a position detection method and a vapor deposition device which can improve detection precision of positions of a substrate. An image processing unit (20) calculates relative positions of cameras (11) of a front imaging unit on the basis of results of imaging substrate marks (Wm) by each camera (11) of the front imaging unit. The position of a processing substrate (W) based on the front imaging is calculated by using the relative position of the cameras (11) and the results of imaging the processing substrate (W) by each camera (11) of the front imaging unit. The relative position of cameras (12) of a back imaging unit is calculated according to results that each camera (12) of the back imaging unit picks up a transmission image of the substrate marks (Wm). The position of the processing substrate (W) based on the back imaging is calculated by using the relative position of the cameras (12) and the imaging results of each camera (12)of the back imaging unit