TWI665170B

The present invention addresses the technical problem of contributing to high-density mounting of a semiconductor package by devising a supporting glass substrate that resists dielectric breakdown in a semiconductor package production step. This semiconductor supporting glass substrate is characterized by including a first surface that is a side to which a semiconductor substrate is to be laminated, and a second surface that is a surface on a side opposite the first surface, and by including a roughened surface area having a surface roughness Ra of 0.3 nm or greater and a surface roughness Rmax of 100 nm or less on the first surface and/or the second surface.