Substrate peeling device, and substrate peeling method

A substrate peeling device and a substrate peeling method capable of peeling the resin substrate from the support body well are provided. A substrate peeling device is a substrate peeling device of peeling off the resin substrate of which the plane shape is a rectangle formed on the support body, in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKASE, SHINJI, MASU, YOSHIAKI, KIKUCHI, HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!