Substrate peeling device, and substrate peeling method

A substrate peeling device and a substrate peeling method capable of peeling the resin substrate from the support body well are provided. A substrate peeling device is a substrate peeling device of peeling off the resin substrate of which the plane shape is a rectangle formed on the support body, in...

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Bibliographische Detailangaben
Hauptverfasser:	TAKASE, SHINJI, MASU, YOSHIAKI, KIKUCHI, HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate peeling device and a substrate peeling method capable of peeling the resin substrate from the support body well are provided. A substrate peeling device is a substrate peeling device of peeling off the resin substrate of which the plane shape is a rectangle formed on the support body, including: at least a corner portion arranged at the resin substrate and insertion portions capable of being inserted into the interface between the corner portion and the resin substrate; a moving mechanism relatively moving the insertion portion and the support body under condition of inserting the insertion portion into the interface; and a peeling mechanism retaining the resin substrate and peeling the resin substrate from the support body using a slit that is formed at the interface by the insertion portion as a base point.