Method of imprint lithography of conductive materials; stamp for imprint lithography, and apparatus for imprint lithograph

A method of patterning with imprint lithography, a stamp for imprint lithography, an imprint roller of a roll-to-roll substrate processing apparatus, and a substrate processing apparatus are described. The method includes providing a layer of a conductive paste on a substrate, wherein the conductive...

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Bibliographische Detailangaben
Hauptverfasser:	CUNNINGHAM, KEVIN L, VISSER, ROBERT JAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method of patterning with imprint lithography, a stamp for imprint lithography, an imprint roller of a roll-to-roll substrate processing apparatus, and a substrate processing apparatus are described. The method includes providing a layer of a conductive paste on a substrate, wherein the conductive paste has a viscosity of 0.3 Pa.s or above, particularly of 1.5 Pa.s or above; imprinting a stamp in the layer of the conductive paste to generate a patterned layer of the conductive paste; fully or partially curing the patterned layer; and releasing the stamp from the patterned layer.