FLEXIBLE SUBSTRATE AND CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

A method of manufacturing a flexible substrate and circuit structure includes following steps. A debond layer is formed on a carrier. At least one chip is disposed on the debond layer. A polymer material is formed to cover at least a portion of sidewall of the at least chip. The polymer material is...

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Bibliographische Detailangaben
Hauptverfasser:	YU, WANGIEH, HSIAO, HSIA-TSAI, CHANG, SHU-HAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of manufacturing a flexible substrate and circuit structure includes following steps. A debond layer is formed on a carrier. At least one chip is disposed on the debond layer. A polymer material is formed to cover at least a portion of sidewall of the at least chip. The polymer material is cured into a polymer substrate. The polymer substrate is separated from the debond layer, wherein the at least one chip is embedded in the polymer substrate. A first circuit structure is formed on a first surface of the polymer substrate, and the first circuit structure is electrically connected to a first pad of the at least one chip.