TWI661087B

A method for modifying a non-plated copper and copper alloy surface which comprises an oxidative pretreament step and a low temperature roughening and porousifying step. In the oxidative pretreatment treatment step, a copper-containing object to be treated is heated to produce an oxide layer on the surface of the object to be treated. In the low temperature roughening and porousifying step, an organic acid gas-containing gas mixture is heated, and the heated gas mixture is then catalyzed by platinum and sprayed to the oxide layer of the object to be treated so as to reduce the oxide layer to form a rough and porous copper surface. The present invention performs the oxidative pretreament step and then performs the low temperature roughening and porousifying step, which can rapidly modify the object to be treated, and is different from other complicate surface modification methods, such as sputtering, evaporation, or mechanical processing.