TWI660059B

An embodiment of the present invention is a method for repairing a backing plate 20 comprising a copper base 22 with a deficient area 24. The method comprises a step for polishing the surface of the deficient area 24, and a step after the polishing step for spraying and depositing repair particles o...

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Bibliographische Detailangaben
Hauptverfasser:	HATA, HIDEO, NAKANE, YASUO, OUCHI, YASUHIRO
Format:	Patent
Sprache:	chi
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMBINED OPERATIONS DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER WORKING OF METAL PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:	An embodiment of the present invention is a method for repairing a backing plate 20 comprising a copper base 22 with a deficient area 24. The method comprises a step for polishing the surface of the deficient area 24, and a step after the polishing step for spraying and depositing repair particles on the deficient area 24. The repair particles comprise copper particles and ceramic particles.