Cover layer and application thereof

A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimid...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHEN, YEN-HSIANG, LIN, SHENGIN, WU, YAO-MING, CHEN, YI-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa·s when polyimide layer is under a temperature in a range of 60° C. to 160° C.