Composition for forming silica layer, silica layer, and electronic device

The present invention relates to a composition for forming a silica layer containing a silicon-containing polymer satisfying formulas 1 and 2 during 1H-NMR spectrum, and a solvent. Formula 1 is B / A = 0.2 to 0.4, and formula 2 is (A + B) / C = 4.8 to 12.0. The definitions of the above formulas 1 an...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JINGYO, SIM, SOOYEON, LEE, JIHO, JOO, YOUNGJAE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY METALLURGY NON-METALLIC ELEMENTS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a composition for forming a silica layer containing a silicon-containing polymer satisfying formulas 1 and 2 during 1H-NMR spectrum, and a solvent. Formula 1 is B / A = 0.2 to 0.4, and formula 2 is (A + B) / C = 4.8 to 12.0. The definitions of the above formulas 1 and 2 are as described in the specification.