Resin composition for encapsulation and semiconductor device

This resin composition for sealing molds around a semiconductor element comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, and (D) a diaminotriazine compound represented by general formula (1). (In the formula, R is a monovalent organic group.)

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	TABEI, JUN-ICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This resin composition for sealing molds around a semiconductor element comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, and (D) a diaminotriazine compound represented by general formula (1). (In the formula, R is a monovalent organic group.)