ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

The invention discloses an electronic package and a manufacturing method thereof. A first shielding layer and a first electronic element are arranged on a first side of a bearing structure; accordingto the electronic packaging piece, the first shielding layer is arranged on the first side of the bea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LAI, HOU REN, CHIANG, CHENG CHIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention discloses an electronic package and a manufacturing method thereof. A first shielding layer and a first electronic element are arranged on a first side of a bearing structure; accordingto the electronic packaging piece, the first shielding layer is arranged on the first side of the bearing structure, the second electronic element and the packaging layer wrapping the second electronic element are arranged on the second side of the bearing structure, and then the second shielding layer is arranged on the packaging layer, so that the first electronic element and the second electronic element do not influence each other due to the first shielding layer and the second shielding layer, and the reliability of the electronic packaging piece is improved.