TWI644968B

PROBLEM TO BE SOLVED: To provide a resin substrate for a circuit board, which has a small relative dielectric constant ( ) and a small dissipation factor (tanδ), and is small in the degree of dependence of and tanδ on frequency or temperature.SOLUTION: A resin substrate for a circuit board comprises...

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Bibliographische Detailangaben
Hauptverfasser:	KIMURA, YUU, UNO, TAKAAKI, HATASE, KAZUKI, FUJITOMI, SHINTAROU
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin substrate for a circuit board, which has a small relative dielectric constant ( ) and a small dissipation factor (tanδ), and is small in the degree of dependence of and tanδ on frequency or temperature.SOLUTION: A resin substrate for a circuit board comprises: at least a polymer (A) having a structural unit expressed by the following formula (1).SELECTED DRAWING: None