Substrate processing apparatus

The purpose of the present invention is to provide technology for suppressing the soiling of substrates. A substrate processing device comprises a substrate holding unit for holding a substrate horizontally, a processing liquid supply unit for supplying processing liquid toward the substrate held by...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIMURA, TAKASHI, YUKI, YOSHIAKI, MIYAJI, NOBUYUKI, HIRASHITA, TOMOMI, UCHIDA, HIROAKI, TOKURI, KENTARO, TAMAKI, YASUTO, OKUYA, YOSUKE, SUZUKI, TATSUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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