Substrate processing apparatus

The purpose of the present invention is to provide technology for suppressing the soiling of substrates. A substrate processing device comprises a substrate holding unit for holding a substrate horizontally, a processing liquid supply unit for supplying processing liquid toward the substrate held by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA, TAKASHI, YUKI, YOSHIAKI, MIYAJI, NOBUYUKI, HIRASHITA, TOMOMI, UCHIDA, HIROAKI, TOKURI, KENTARO, TAMAKI, YASUTO, OKUYA, YOSUKE, SUZUKI, TATSUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide technology for suppressing the soiling of substrates. A substrate processing device comprises a substrate holding unit for holding a substrate horizontally, a processing liquid supply unit for supplying processing liquid toward the substrate held by the substrate holding unit, and a liquid receiving unit that surrounds the substrate holding unit and receives processing liquid which has splashed off of the substrate. The inner peripheral surface of the liquid receiving unit has a plurality of grooves exposed toward the substrate held by the substrate holding unit, and the direction of extension of the plurality of grooves includes vertical-direction components. As a result, droplets of processing liquid readily collect in the grooves and fall due to the weight of the droplets.