TWI644171B

The invention provides a photosensitive resin composition, a photosensitive element, a method of forming an anti-corrosion pattern and a method of manufacturing a PCB. The photosensitive resin composition comprises an adhesive polymer (A), a light polymerized compound (B)possessing an olefinic unsat...

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Bibliographische Detailangaben
Hauptverfasser:	MIYASAKA, MASAHIRO, FUKAYA, TAKAHIRO, ISO, JUNICHI
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a photosensitive resin composition, a photosensitive element, a method of forming an anti-corrosion pattern and a method of manufacturing a PCB. The photosensitive resin composition comprises an adhesive polymer (A), a light polymerized compound (B)possessing an olefinic unsaturated bond and a photopolymerization initiator (C), and the component A comprises, by mass, 50%-80% of structure units (a1) come from (methyl) acrylic benzyl ester derivatives, 5%-40% of structure units (a2) come from styrene derivatives, 1%-20% of structure units (a3) come form alkyl (meth)acrylate, and 5%-30% of structure units (a4) come from (meth) acrylate.