Laminate, method for manufacturing semiconductor device, surface protection film for semiconductor, and resin modifier

A stress relaxation film comprising: a thermoplastic resin (A) which comprises a copolymer that contains 70 to 90 mol% of a constituent unit derived from 4-methyl-1-pentene and 10 to 30 mol% of a constituent unit derived from a C2 or C3 α-olefin, and contains a constituent unit derived from a C4-20...

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Bibliographische Detailangaben

Hauptverfasser:	TAMO, YOSHISADA, UEKUSA, TAKAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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