Laminate, method for manufacturing semiconductor device, surface protection film for semiconductor, and resin modifier

A stress relaxation film comprising: a thermoplastic resin (A) which comprises a copolymer that contains 70 to 90 mol% of a constituent unit derived from 4-methyl-1-pentene and 10 to 30 mol% of a constituent unit derived from a C2 or C3 α-olefin, and contains a constituent unit derived from a C4-20 α-olefin other than 4-methyl-1-pentene in an amount of 10 mol% or less; and a thermoplastic resin (B) which comprises at least one polymer selected from the group consisting of an ethylene polymer, a propylene polymer, a butene polymer and a 4-methyl-1-pentene polymer and is different from the thermoplastic resin (A). In the stress relaxation film, the content of the thermoplastic resin (A) is 50 to 98 mass% relative to the whole mass of the film and the content of the thermoplastic resin (B) is 2 to 50 mass% relative to the whole mass of the film.