TWI641729B

An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAO, TOSHIMITSU, OTSUKA, KUNIAKI, TSUJIMOTO, TAKAMITSU, HARA, KENJI, KATAYAMA, JUNICHI
Format:	Patent
Sprache:	chi
Schlagworte:	ALLOYS APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!