TWI641729B

An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAGAO, TOSHIMITSU, OTSUKA, KUNIAKI, TSUJIMOTO, TAKAMITSU, HARA, KENJI, KATAYAMA, JUNICHI
Format:	Patent
Sprache:	chi
Schlagworte:	ALLOYS APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1), wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.