TWI641729B
An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble co...
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| creator | NAGAO, TOSHIMITSU OTSUKA, KUNIAKI TSUJIMOTO, TAKAMITSU HARA, KENJI KATAYAMA, JUNICHI |
| description | An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1),
wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3,
and a hydroxyl group-containing aromatic compound. |
| format | Patent |
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€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1),
wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3,
and a hydroxyl group-containing aromatic compound.</description><language>chi</language><subject>ALLOYS ; APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181121&DB=EPODOC&CC=TW&NR=I641729B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181121&DB=EPODOC&CC=TW&NR=I641729B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAO, TOSHIMITSU</creatorcontrib><creatorcontrib>OTSUKA, KUNIAKI</creatorcontrib><creatorcontrib>TSUJIMOTO, TAKAMITSU</creatorcontrib><creatorcontrib>HARA, KENJI</creatorcontrib><creatorcontrib>KATAYAMA, JUNICHI</creatorcontrib><title>TWI641729B</title><description>An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1),
wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3,
and a hydroxyl group-containing aromatic compound.</description><subject>ALLOYS</subject><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0MzE0N7J04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC5cbiA</recordid><startdate>20181121</startdate><enddate>20181121</enddate><creator>NAGAO, TOSHIMITSU</creator><creator>OTSUKA, KUNIAKI</creator><creator>TSUJIMOTO, TAKAMITSU</creator><creator>HARA, KENJI</creator><creator>KATAYAMA, JUNICHI</creator><scope>EVB</scope></search><sort><creationdate>20181121</creationdate><title>TWI641729B</title><author>NAGAO, TOSHIMITSU ; OTSUKA, KUNIAKI ; TSUJIMOTO, TAKAMITSU ; HARA, KENJI ; KATAYAMA, JUNICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI641729BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2018</creationdate><topic>ALLOYS</topic><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAO, TOSHIMITSU</creatorcontrib><creatorcontrib>OTSUKA, KUNIAKI</creatorcontrib><creatorcontrib>TSUJIMOTO, TAKAMITSU</creatorcontrib><creatorcontrib>HARA, KENJI</creatorcontrib><creatorcontrib>KATAYAMA, JUNICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAO, TOSHIMITSU</au><au>OTSUKA, KUNIAKI</au><au>TSUJIMOTO, TAKAMITSU</au><au>HARA, KENJI</au><au>KATAYAMA, JUNICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI641729B</title><date>2018-11-21</date><risdate>2018</risdate><abstract>An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1),
wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3,
and a hydroxyl group-containing aromatic compound.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | TWI641729B |
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