TWI637085B

The purpose of the present invention is to provide a nickel plating liquid capable of causing solid microparticles such as diamond microparticles to be fixed to the surface of a wire in a uniformly dispersed state without causing the solid microparticles to aggregate, and to provide a method for man...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KISHI, KAZUYUKI, MITSUI, HIDEO
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR BROACHING CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PLANING POLISHING PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SAWING SCRAPING SHEARING SLOTTING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a nickel plating liquid capable of causing solid microparticles such as diamond microparticles to be fixed to the surface of a wire in a uniformly dispersed state without causing the solid microparticles to aggregate, and to provide a method for manufacturing a wire to which solid microparticles are attached using the nickel plating liquid, and the wire to which solid microparticles are attached. In order to achieve this purpose, a nickel plating liquid containing a polyamine as a dispersing agent and solid microparticles provided with an inorganic coating layer applied by a surface modification treatment is employed as a nickel plating liquid for forming an electrolytic nickel plating layer containing dispersed solid microparticles on the surface of a wire.