Wet cleaning equipment for semiconductor chip

The invention provides a semiconductor wafer wet method cleaning device. The semiconductor wet method cleaning device comprises multiple potchers, a waste water drainage pipeline, a recyclable water use pipeline and a control module. Drainpipes and tee valves are arranged in the potchers. The tee va...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: ZHAO, HOUYING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention provides a semiconductor wafer wet method cleaning device. The semiconductor wet method cleaning device comprises multiple potchers, a waste water drainage pipeline, a recyclable water use pipeline and a control module. Drainpipes and tee valves are arranged in the potchers. The tee valve comprises a first water inlet port, a first water outlet port and a second water outlet port. The first water inlet port is connected to the drainpipe; the first water outlet port is connected to the waste water drainage pipeline; the second water outlet port is connected to the recyclable wateruse pipeline; the control module communicates with the tee valves and controls the tee valves to make the drain water of the potchers connect to the waste water drainage pipeline for drainage or connect to the recyclable water use pipeline for recyclable usage. The semiconductor wafer wet process cleaning device realizes effective recycling on drainage water which is cleaned through the wet method, and is flexible, conve