Wet cleaning equipment for semiconductor chip
The invention provides a semiconductor wafer wet method cleaning device. The semiconductor wet method cleaning device comprises multiple potchers, a waste water drainage pipeline, a recyclable water use pipeline and a control module. Drainpipes and tee valves are arranged in the potchers. The tee va...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a semiconductor wafer wet method cleaning device. The semiconductor wet method cleaning device comprises multiple potchers, a waste water drainage pipeline, a recyclable water use pipeline and a control module. Drainpipes and tee valves are arranged in the potchers. The tee valve comprises a first water inlet port, a first water outlet port and a second water outlet port. The first water inlet port is connected to the drainpipe; the first water outlet port is connected to the waste water drainage pipeline; the second water outlet port is connected to the recyclable wateruse pipeline; the control module communicates with the tee valves and controls the tee valves to make the drain water of the potchers connect to the waste water drainage pipeline for drainage or connect to the recyclable water use pipeline for recyclable usage. The semiconductor wafer wet process cleaning device realizes effective recycling on drainage water which is cleaned through the wet method, and is flexible, conve |
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