Method for cleaning semiconductor substrate and method for fabricating semiconductor device

The present invention relates to a method for cleaning a substrate such as a semiconductor substrate for the manufacture of an integrated circuit. The method includes cleaning a semiconductor substrate with a first mixture consisting of ozone and at least one of an acid and a base, followed by a sec...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YEH, MING HSI, JANG, SYUN MING, CHOU, BO WEI, WU, SUNG HSUN, CHEN, CHAO CHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!