TWI625989B

[Problem] To provide a copper foil for a wiring board which exhibits good visibility after forming a circuit pattern and high peel strength under normal conditions and in which heat-resistant peel strength is maintained at a high level; and a copper-clad laminated board. [Solution] Provided is a copper foil having, on at least one surface of the copper foil, a roughened particle layer comprising roughened particles having an arithmetic mean height of 0.05-0.5 μm, and having, on the roughened particle layer, a diffusion prevention coating layer, which contains at least nickel and zinc and in which the (mass) ratio of the quantity of nickel deposited on the roughened particle layer relative to the quantity of zinc deposited on the roughened particle layer falls within the range 0.5-20, wherein the diffused reflectance (Rd) at a wavelength of 600 nm, as measured from the side of the one surface, falls within the range 5-50% and the chroma (C*) is 30 or lower. Also provided is a copper-clad laminated board having